发明名称 INSPECTION OF SOLDERING
摘要 PURPOSE:To obtain a highly reliable printed circuit board, by inspecting a continuity state in such a manner that a printed wiring board is curved into a circular arc shape so as to render a surface having a lead pin soldered thereto to a protruding side. CONSTITUTION:Housings 20, 21 are together formed into a rectangular cylindrical form and the lower side 20a of the housing 20 on the side of the long side thereof is formed into a protruding circular arc shape and the upper side 21a of the housing 21 on the side of the long side thereof is formed into a recessed circular arc shape. Further, the lower side 20a and upper side 21a of the housings 20, 21 have the same radius of curvature so as to be mutually engaged. A printed wiring board 11 is arranged between the housings 20, 21 so that the surface having an electronic part 13 mounted thereon, that is, the surface having a lead pin 1 soldered thereto is turned downwardly. When pressure is applied between the housings 20, 21 in this state, the wiring board 11 is curved into a circular arc shape and the part where no solder 15 is applied and the pin 14 is merely mechanically brought into contact with a pattern electrode 12 is separated with curving. Therefore, no signal voltage is generated in the corresponding electrode pad 17 and the pin 14 having no solder applied thereto can be certainly discriminated.
申请公布号 JPS63282672(A) 申请公布日期 1988.11.18
申请号 JP19870117650 申请日期 1987.05.14
申请人 TOSHIBA CORP 发明人 WATANABE SHIGEO
分类号 G01R31/02;B23K1/00;H05K3/34 主分类号 G01R31/02
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