| 摘要 |
PURPOSE:To decrease direct contact portions of leads with a die to avoid the peeling of solder plating by bending the lead in the oblique upper direction while a circular arc at 120 deg. or more is shaped by a revolving roller when the nose of the lead is formed and forming the lead in the oblique lower direction by the roller. CONSTITUTION:A lead 2 is lifted in the oblique upper direction by a lead push-up die 4, a nose bending roller 6 is lowered together with a pad 5a, and the lead is formed to an arcuate shape at approximately 120 deg.-150 deg., following the arcuate section of the upper corner section 4b of the die 4. A pad 5b is brought down in an oblique lower bending section, and the lead 2 for an IC to be machined is bent in the oblique lower direction by an oblique lower bending roller 9. A vacuum port 13a is shaped to an arcuate section at approximately 90 deg. including the lowermost point of a groove 12a in a curling die 11a in a J-shaped lead forming section, and a pad 5c is lowered and the lead is formed to a J shape along a groove 12b. Accordingly, a resin burr falling at the time of curling can be sucked by the vacuum port 13a, thus reducing the adhesion of solder plating to the die.
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