| 摘要 |
<p>The invention relates to a power module, comprising a printed circuit (1, 16) rigidly attached onto a heat sink (2, 17) on which are deposited one or more power silicon chips (10, 25) by directly soldering or bonding so as to enable heat to be removed and distributed between the various chips (10, 25), the electrical linkage between the various output ranges (7, 9) of the silicon chips (10, 25) and the connections being carried out by ultrasonic soldering of an aluminium wire between the output ranges (7, 9) of the silicon chips (10, 25) themselves and the printed circuit (1, 16) which thus enables the current to pass to a connector (13) connected directly to the latter. The module according to the invention is characterised in that the heat sink part (2) on which the silicon chips (10) are mounted comprises extruded parts (4, 5) enabling it to provide its own linkage with the printed circuit (1). Application to the motor vehicle industry.</p> |
