发明名称 Method of producing a patterned metal contact on a semiconductor wafer
摘要 A method is provided for producing patterned metal contacts having a thickness of up to 3 mu m. The method is based on a lift-off technique in which the photosensitivity of the upper layer of a photoresist layer (2) is modified by exposure to chlorobenzene. The photoresist layer (2) prepared in this way is patterned and covered with a thick metal layer (5). A channel (6) is generated through the metal layer (5) and lays bare an edge (4) and a resist bead (3) produced as a consequence of the chlorobenzene treatment. As a result of the channel (6), the photoresist layer (2) is dissolved and the metal layer (5) on top of it is lifted off. <IMAGE>
申请公布号 DE3715431(A1) 申请公布日期 1988.11.17
申请号 DE19873715431 申请日期 1987.05.08
申请人 SIEMENS AG 发明人 BITTNAR,JUTTA
分类号 H01L21/027;(IPC1-7):H01L29/46;H01L21/312 主分类号 H01L21/027
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