| 摘要 |
<p>A small multilayer capacitor, such as an MLC capacitor (10) has in one of its end terminations (16 and 18) a passivation layer (17) surrounded by nested sputter-coated metallization films (22, 24, 26 and 28) to provide a safeguarding feature so that the capacitor will not fail short. A process for providing the terminations (16 and 18) at the ends of the chips for such small MLC capacitors includes applying at least three nested thin films of metallization at the opposite ends of each chip and forming the passivation layer (170) before applying the outer nested films, and finally removing a portion of thin films of metallization material intermediate the ends, to provide an MLC capacitor having proper metallized end terminations. Preferably, the thin films are applied to cover the entire surface of each chip by sputtering thin film material onto a batch of tumbling chips.</p> |
