| 摘要 |
In order to produce an arrangement having two coupled laser diodes, especially a cleaved-coupled-cavity arrangement (C<3> arrangement), a carrier (1) is specified which contains two limbs (2), which run at an angle (13) with respect to one another, and a connecting part (3) having a planar surface (4) at right angles to the angle bisector (14) of the angle (13) between the limbs (2). A chip is aligned with the planar surface (4) and is mounted on the carrier (1). The chip, which has previously been scratched, is broken into two laser diodes (11) by reducing the angle (13) between the limbs (2). The distance between the laser diodes (11) is adjusted by optimising the properties of the laser radiation, since the resonator mirrors (8) are freely accessible during the production process. <IMAGE>
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