发明名称 POLYAMIDE BASED RESIN COMPOSITION
摘要 PURPOSE:To obtain a resin composition consisting of a polyamide based resin, styrenic resin and specific terpolymer and having excellent chemical resistance, falling ball impact strength, surface appearance, thermal stability and workability in the moldings thereof. CONSTITUTION:The aimed composition consisting of (A) 100pts.wt. polyamide based resin (preferably polyamide 6 or polyamide 66), (B) 20-300pts.wt. styrenic polymer (preferably graft polymer such as acrylonitrile-diene based rubber- styrene polymer) and (C) 0.5-200pts.wt. terpolymer consisting of C1: 50-98.5wt.% olefin, preferably 55-96wt.% ethylene and/or propylene, C2: 0.5-10wt.% unsaturated dicarboxylic acid anhydride, preferably 1-8wt.% maleic anhydride and C3: 1-40wt.% unsaturated carboxylic acid alkyl ester, preferably 3-37wt.% ethyl acrylate and/or butyl acrylate.
申请公布号 JPS63280764(A) 申请公布日期 1988.11.17
申请号 JP19870116369 申请日期 1987.05.12
申请人 SUMITOMO NAUGATUCK CO LTD 发明人 MOTOMATSU KAZUHIKO;NISHIKUBO YOSHIAKI;AOKI HIROMITSU;UMEYAMA SATORU
分类号 C08L25/04;C08L23/00;C08L23/08;C08L25/06;C08L25/12;C08L51/00;C08L73/00;C08L77/00 主分类号 C08L25/04
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