发明名称 LOOP PLATING METHOD AND APPARATUS
摘要 PURPOSE:To carry out uniform loop plating of a loop-shaped wire with high productivity by moving the wire with shifts of the loops in the forward direction, plating the loops during the movement, moving the plated loops in a direction perpendicular to the forward direction and further plating the loops. CONSTITUTION:A loop-shaped wire is moved in the first direction of an arrow 21 with a belt conveyor 6 with shifts of the lops 20 in the forward direction until the wire is put in a plating tank 1. In the tank 1, the loops 20 are moved with driving rolls 5 and electric current is supplied through electrifying rolls 8, 9 to plate the loops 20. The plated loops 20 are moved in the first direction 21 with a belt conveyor 7 and further moved in the second direction of an arrow 22 nearly perpendicular to the direction 21 with a belt conveyor 13 until the loops 20 are put in a plating tank 2. In the tank 2, the loops 20 are similarly plated. Since the overlapped edge parts of the loops 20 are shifted, the loops 20 are uniformly plated over the entire circumference. After loop plating is completed, the loops 20 are sent out with a belt conveyor 14.
申请公布号 JPS63277791(A) 申请公布日期 1988.11.15
申请号 JP19870112467 申请日期 1987.05.11
申请人 KOBE STEEL LTD 发明人 OGINOYA HIKARI;MORITA KEIICHI;USUI KOKI
分类号 C25D7/06 主分类号 C25D7/06
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