发明名称 Method of mounting heat sinks
摘要 Disclosed is a compensating roll pin securing a heat sink to a circuit board. The roll pin comprises a deformable body of resilient material, such as annealed spring steel, formed into a generally cylindrical body having first and second end portions separated by a middle portion of enlarged external diameter and an axially extending gap in the surface of the body. A method of use is also disclosed wherein the first end portion of the roll pin is inserted into an aperture in a heat sink and the middle portion deformed within the aperture to form a tight fit between the pin and heat sink. A substantial part of the middle portion remains outside the aperture in the heat sink. The second end portion is inserted into a hole in a circuit board and forms an interference fit therewith. The middle portion forms a stop to prevent further insertion of the roll pin into the circuit board so that a gap of predetermined distance separates the heat sink and circuit board to enhance cooling.
申请公布号 US4783899(A) 申请公布日期 1988.11.15
申请号 US19870126822 申请日期 1987.11.30
申请人 THERMALLOY INCORPORATED 发明人 BREESE, LEONARD S.
分类号 H05K7/20;(IPC1-7):B23P19/02 主分类号 H05K7/20
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