| 摘要 |
PURPOSE:To make it possible to form a flat outer shape and to implement miniaturization, by forming outer terminals as spherical protruding electrodes, using an insulating board, thereby removing the projections of long lead wires, and fixing a pressure sensitive part directly on the board. CONSTITUTION:A semiconductor pressures sensitive part 1 is fixed to a metal layer 72 around a pressure introducing hole 5 with a solder. Each electrode 14 on a chip 11 is connected to a wiring 71 by bonding with a conductor wire 25. Signal electronic circuits from the pressure sensitive part 1 are mounted on the wirings in the chip 11 and on an insulating board 4. A spherical body 8, whose diameter is larger than a wiring through hole 6, is fixed with a solder 9 and is made to extrude from the lower surface of the board 4. The spherical body 8 is mounted and heated on a place, where the protruding electrode is to be connected. A reserve solder 10 on the spherical body 8 is fused again by heating and attached to a wiring conductor. The melting point of the solder 9 is higher than that of the solder 10. The connection to the wiring conductor can be performed with the protruding electrode 8.
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