发明名称 ALLOCATING SYSTEM FOR TERMINAL OF PACKAGE SUBSTRATE
摘要 PURPOSE:To reduce the designing manhours of wirings by using a means which selects an unconnected connection terminal of a package substrate out of those connection terminals of said package substrate based on the value closest to a coordinate value in the array direction of the connection terminals of the package substrate for the connection terminal of a circuit part. CONSTITUTION:A parts pin b5 having the maximum Y axis coordinate value is first extracted and a package substrate terminal a8 having the same Y axis coordinate value as the pin b5 is selected. If the terminal having the same coordinate value of the pin b5 is not detected, a package substrate terminal having the coordinate value closest to the Y axis coordinate value of the extracted pin b5 is selected. Then a package substrate terminal having the minimum Manhattan distance from the pin b5 is allocated to the relevant parts pin within a range including upper and lower (p) pieces of terminals centering on the selected package substrate terminal (p equal to 1 in this example). The wiring between those allocated package substrate terminal and parts pin is set so that it does not cross another completed wiring.
申请公布号 JPS63276177(A) 申请公布日期 1988.11.14
申请号 JP19870110327 申请日期 1987.05.06
申请人 NEC CORP 发明人 MATSUMOTO IWASA;KOYAMA NAOKAZU
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
主权项
地址