发明名称 MOLDING RESIN COMPOSITION
摘要 PURPOSE:To obtain a resin compsn. having improved flowability and improved adhesion between a resin and a filler, by compounding a filler comprising silica particles having cleaned surfaces with a resin. CONSTITUTION:A molding resin compsn. comprised mainly of a resin and an inorg. filler, wherein silica particles having cleaned surface are used as the filler. The silica to be applied may be molten silica, crystalline silica or molten silica partially contg. crystalline components. The silica particles having cleaned surfaces can be readily obtd. by treating silica particles with, for example, an aq. alkali soln. and subsequently removing fine particles by sedimentation etc. The alkali component of the employed aq. alkali soln. is pref. a nitrogen compd. Examples of the nitrogen compds. are ammonia, urea, a prim. sec. or tert. alkylamine of the formula NR<1>R<2>R<3> (wherein R<1>, R<2> and R<3> are each alkyl) and a quat. alkylammonium compd.
申请公布号 JPS63275666(A) 申请公布日期 1988.11.14
申请号 JP19870110640 申请日期 1987.05.08
申请人 TORAY IND INC 发明人 IWAYAMA KAZUYOSHI;INOUE TAKEHISA
分类号 C08K7/26;C08K7/16;C08L101/00 主分类号 C08K7/26
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