| 摘要 |
PURPOSE:To prevent contact between outer leads attributable to the bend of a multilayer interconnection substrate by a method wherein the distance between surface-mounted semiconductor integrated circuits is so set that it may be longer toward the middle of the multilayer interconnection substrate. CONSTITUTION:On a multilayer interconnection substrate 1, a plurality of surface mount type semiconductor integrated circuits 2 is laterally installed. Here, when the distances of outer leads of the semiconductor integrated circuits 2 measured from an end of the multilayer interconnection substrate 1 are presumed to be d1, d2, and d3, the relationship between the distances should be d3>d2>d1. That is, the distances d3 and d2 at and near the middle of the multilayer interconnection substrate 1 are so set that outer leads 3 will not experience mutual contact because of a bend of the multilayer interconnection substrate 1. With the module being designed as such, in a process of inserting the multilayer interconnection substrate 1 into a receptacle through the intermediary of external terminals 4, contact between outer leads 3, which is apt to take place at the middle where outer leads 3 experience the greatest degree of bend reflecting the bend of the multilayer interconnection substrate 1, may be prevented.
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