| 摘要 |
<p>PURPOSE:To realize a thin structure of package mounting a CCD or EPROM by providing semiconductor elements on a transparent plate with the flip-chip method and then covering the rear surface of elements with resin. CONSTITUTION:A semiconductor element 13 which requires light such as a CCD or EPROM is previously bonded, by the flip-chip method, in such a way that a bump thereof 13a is bonded to a pad 12 to a transparent plate 10 providing an external lead 11, wire conductive to external lead 11 and a pad 12. The rear surface of semiconductor elements is covered with a heat resistant resin film, the surrounding thereof is bonded to the transparent plate 10 and these are sealed therefrom with resin 15. Accordingly, the light required for operation of semiconductor elements 13 is applied through the transparent plate 10. Thereby, positioning of elements can be done easily with the self-aligning property. In addition, sealing is done by resin 15 without a ceramic substrate and thereby thin structure and low cost of package can be realized.</p> |
