发明名称 INTEGRATED CIRCUIT PACKAGE
摘要 <p>PURPOSE:To change wirings without complicating design of wiring plate by cancelling electrical connection between an integrated circuit chip and a connecting pin with a modification pin for moving a connecting pin cutting member from outside while it is in contact therewith and changing electrical connection of integrated circuit chip through the modification. CONSTITUTION:For change of electrical connection of integrated circuit chip 3, the horizontal part 13 of modification pin 8 is inserted into a hole 17 for inserting modification pin 8. The end of horizontal part 13 of inserted modification pin 8 pushes upward a connecting pin cutting member 7 from the lower end. The connecting pin cutting member 7 pushed upward presses upward a lead 6 at the upper end thereof, cancelling connection between the lead 6 and connecting pin 4. The modification pin 8 engages its projected portion 8, after insertion of the horizontal portion, with a modification pin guide hole 16 of a case cover 15 in order to fix such projected portion on the case cover 15. Finally, electrical connection among the integrated circuit chip 3, connecting pin cutting member 7, modification pin 8 and connecting wire 18 can be established by winding the external connecting wire 18 at the upper end of the modification pin 8.</p>
申请公布号 JPS63274166(A) 申请公布日期 1988.11.11
申请号 JP19870110256 申请日期 1987.05.06
申请人 NEC CORP 发明人 HYODO TAKESHI
分类号 H01L23/50;H01L23/52 主分类号 H01L23/50
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