| 摘要 |
PURPOSE:To band uniformly external leads, and facilitate the mounting onto a printed wiring board and the like, by forming the leads while pinching both surfaces of the external leads of a mold IC with rotary rollers. CONSTITUTION:At the time of forming the external lead part 2 of a mold IC 1, it is retained and fixed by dies 3, 4 for lead formation. Both sides of the external lead part 2 are pinched by punch rollers 5, 6 for lead formation, and made to descend in the direction of lead formation to bend the external lead 2. As the external lead 2 of the mold IC 1 formed in this manner is bent while being pressed by dies 3, 4, the lead is surely bent from a lead formation shoulder 7, and the spring back can be reduced. Thereby, the external lead can be uniformly bent, and the mounting onto a printed wiring boad and the like is easily enabled.
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