| 摘要 |
PURPOSE:To make the addition of working processes unnecessary, and prevent the generation of short-circuit, by interposing a retainer of solder to retain semiconductor elements at the time of bonding the semiconductor elements with a wiring board. CONSTITUTION:In addition to a metal layer 3 constituting a wiring, a plurality of metal layer regions 4 which are not in contact with the wiring are arranged so as to almost uniformly disperse. The total area of the metal layer region 4 is larger than the total contact area between semiconductor elements 5 and the wiring of bumps 6. Between the metal layer region 4 and the insulating layer 8 of semiconductor element surface, retainers made of solder interpose, and uniformly receive the load which the semiconductor elements apply to the substrate. Therefor, the semiconductor chip surface of the semiconductor element and the substrate surface are kept in parallel, and the load applied to the bumps is reduced, so that the generation of collapse of the bump can be prevented. Consequently, short-circuit, due to the phenomenon that the crushed bump comes into contact with a neighboring wiring or a neighboring bump, does not occur.
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