| 摘要 |
<p>PURPOSE:To improve the heat dissipation from a through hole and heat cycle resistance by forming an excellent heat conductivity insulating layer on both the surfaces of a metal plate and by filling a through hole with a synthetic resin which contains many ceramic short fibers. CONSTITUTION:Prepreg sheets 2, 3 using ceramic paper are superposed on the top and the bottom of a metal plate 1 provided with a through hole 1a, a metal foil 4 is superposed on both surfaces and these are processed, heated and formed by a press. The through hole has an insulating layer 6 formed by destroying the ceramic paper by the flow pressure of a resin. A metal core printed circuit board can be obtained by plating the through hole and by forming a wiring circuit pattern 7 after opening a small hole in the through hole 1a of the obtained metal plate 1. The ceramic paper used for the prepreg sheet 2 uses a ceramic short fiber which has a diameter of 5 mum or less and the distribution of a fiber length within the range of 5-500 mum.</p> |
