发明名称 ELECTROMAGNETIC RELAY
摘要 PURPOSE:To relax the adhesion of a contact by making the contact surface layer of a movable contact or a fixed contact with a gold-nickel alloy including less then 3 % nickel, or a gold-palladium alloy including less than 30 % palladium. CONSTITUTION:The surface layer of either a movable contact or a fixed contact is made of a gold-nickel alloy or a gold-palladium alloy, and the content of the nickel in the gold-nickel alloy is set less than 3 %, while the content of the palladium in the gold-palladium alloy is set less than 30 %. In a contact mechanism 30, for example, a movable contact 33 is made by forming a surface layer 33b of gold-1%neckel alloy over a silver liner layer, while the fixed contact 35 at a constantly-closed side and the fixed contact 37 at a constantly- opened side are made by forming surface layers 35b and 37b of gold-1% nickel alloy over silver liner layers 35a and 37a. A contact mechanism 30' is also made in the same manner. In such a composition, even though the unit is cleaned by supersonic waves, the adhesion of the contact is relaxed, the initial operational voltage can be made lower, and moreover, the contact resistance is stabilized, resulting in the improvement of the operational performance.
申请公布号 JPS63274034(A) 申请公布日期 1988.11.11
申请号 JP19870109140 申请日期 1987.05.02
申请人 OMRON TATEISI ELECTRONICS CO 发明人 NAKANISHI YOICHI
分类号 H01H50/54;H01H1/023 主分类号 H01H50/54
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