摘要 |
PURPOSE:To enable the observation of a pellet surface by using an ordinary lens of large magnification, at the time of IC operation, and facilitate the failure analysis, by making the height of an opposite side to the IC lead-take-out side of a lid lower than the surface of a mounted IC. CONSTITUTION:An IC (a ceramic package having no lid or an open-sealed mold package) 3 to be subjected to failure analysis is mounted on a main body 1. A lid 5 is fixed on the main body 1 in the manner in which a projected part 11 and a recessed part 12 formed on the upper surface of the main body 1, and a corresponding recessed part 52 and a corresponding projected part 51 formed on the lower surface of the lid 5 are fitted in each other. In this case, the thickness of a step part 7 is so set that the upper surface of the mounted IC 3 is higher than the height of the stepped part 7 of the lid 5 opposite to a lead-take-out side of the IC 3. Thereby, the surface condition of a IC pellet can be observed with an ordinary lens of large magnification, and the easy failure analysis of the device is enabled.
|