| 摘要 |
PURPOSE:To improve the heat cycle resistance and the soldering thermal resistance of a base material by providing a laminated structure which is formed by the steps of applying anodic oxidation over the surface of an aluminum plate provided with through holes, treating the anodic oxide with a primer or coupling agent, and supperposing prepreg sheets of a specific ceramic and them a metal foil. CONSTITUTION:A through hole 1a is opened in an aluminum plate 1, then treated with anode oxidation by sulfuric acid, chromic acid, etc., and an oxide film layer 2 is formed. Then, a primer treatment is carried out with a direct resin dilute solution or an electrodeposition coating material and a surface treated layer 3 which also seals a hole with a synthetic resin is provided. Then, a laminated board can be obtained by superposing an aluminum plate 1 and a metal foil 5 by using a plurality of prepreg sheets 4 manufactured with ceramic paper and a synthetic resin and by pressurizing, heating and forming. The ceramic paper uses a main raw material of a ceramic short fiber which has a diameter of 5 mum or less and the distribution of a fiber length within the range of 5-500 mum.
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