| 摘要 |
PURPOSE:To manufacture a high quality metal pattern efficiently by forming the metal pattern by separating a top metal film with the pattern made of a masking material after the top metal film is stuck to all the surface of a metal film provided on the surface of a substrate by interposing the pattern made of the masking material. CONSTITUTION:A conductive ground film 2 is formed directly or by interposing a separating type layer on the surface of a polyethylene telephthalate substrate 1. Then, a metal film 3 made of such as copper or nickel is formed on the conductive ground film 2 by electrolytic or electroless plating. A mask pattern 4 is formed with a water soluble masking material on the plated metal film 3. Further, another metal film 5 is stuck on the mask pattern 4. Then, by using a metal pattern obtained by removing the mask pattern 4 for a masking material, etching is done by using an appropriate etching material. A metal pattern printed board itself obtained in this way can be used for a printed circuit board or can also be used by sticking on a plastic board by using adhesives and then by separating the substrate 1. |
