| 摘要 |
<p>PURPOSE:To prevent completely the generation of cracks and dusts on the surface of a semiconductor wafer, by making a semiconductor wafer accommodated in a cassette ascend without inclination by a wafer lifting plate. CONSTITUTION:A wafer lifting plate 4 is provided on the upper part with a groove 5 to retain a semiconductor wafer without inclination. The wafer lifting plate 4 is retained by a lifting plate guide 6, and driven by a lifting level 7 being in contact with the bottom of the wafer lifting plate 4. By lowering a handle on the opposite side of a fulcrum 8 of the lever 7, the water lifting plate 4 is raised along the guide 6, and a semiconductor wafer 1 protrudes in the upper part of a cassette 2 for semiconductor wafer. Thereby, the visual appearance of the semiconductor wafer 1 can be check by a visual checking without generating new cracks and dusts on the wafer surface.</p> |
