| 摘要 |
<p>PURPOSE:To prevent the sealing defect caused by an insufficient flow and the oozing-out of glass sealing material, by adhering the glass sealing material on both ceramic cap and ceramic base, and forming notches on one of the sealing materials. CONSTITUTION:On the upper periphery of a ceramic base 2, glass sealing material is adhered without a break, and a semiconductor element 1 is fixed on an island with silver paste and the like. Electrodes of the semiconductor element 1 are subjected to bonding with metal thin wires 4, and electrically connected to each lead 3. On the otherhand, as to a ceramic cap 6, its sticking surface to the ceramic base 2 is coated with glass sealing material 7, and each of four notches 9 is formed on the nearly centeral part of each side. This sealing material 7 is also previously spread before the semiconductor element 1 is fixed on the ceramic base 2. These ceramic base 2 and ceramic cap 6 are heated at 400-500 deg.C while a pressure is applied, and the glass sealing material is melted to form a sealing part. Thereby, the sealing defect caused by poor flow and the oozing-out of glass sealing material can be prevented.</p> |
