| 摘要 |
PURPOSE:To enable easily the design and the formation of an integrated circuit, by forming conductor segments for a bundle wiring on a master slice constituted by arranging function cells in columns and rows on a semiconductor substrate. CONSTITUTION:On a semiconductor substrate 1 constituting a master slice, a plurality of function cell columns 2 are formed, and in the center part thereof, conductor segments 3 for a bundle wiring are formed, in which a signal wiring 4 connecting to a function cell is formed. Therefor, a bundle of signal lines can be connected to the conductor segments 3 for a bundle wiring, so that it becomes unnecessary to draw around signal lines, and the design and the formation of an integrated circuit are facilitated. |
