| 摘要 |
The cooling unit for equipment using printed circuit modules supplies a refrigeration medium to serpentine tubes respectively associated with heat exchangers integral with the vertically spaced mounting supporting the printed circuit modules. Each of these heat exchangers includes cooling fins in heat exchange relationship with the serpentine tubes carrying the refrigeration medium and extends along the greater part of the respective mounting. Pref. each heat exchanger has a cooling surface area of between 1.5 and 4 sq.m for ensuring that the temp. of the components mounted on the printed circuit boards does not exceed 65 degrees C. The cooling unit allows high density stacking within the equipment stack. |
