| 摘要 |
PURPOSE:To obtain a thermosetting resin composition having excellent solubility in a solvent and giving a cured product having excellent heat-resistance, by reacting a bismaleimide compound with ethynylaniline. CONSTITUTION:The objective thermosetting resin composition can be produced by the thermal reaction of (A) a bismaleimide compound of formula II produced by reacting 1mol. of an aromatic diamine of formula I (n is 0-3; X is O, SO2, S, CO, etc.) with 2mol. of maleic anhydride and subjecting the resultant amic acid compound to dehydrative cyclization with (B) 0.1-4mol. of ethynylaniline of formula III based on 1mol. of the compound A optionally in the presence of (C) a solvent (e.g. acetone or methyl ethyl ketone) at 60-180 deg.C, preferably 80-150 deg.C for 10min-6hr. The composition is useful as a structural material having excellent heat-resistance, a matrix resin for carbon fiber composite material and a resin for powder coating.
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