| 摘要 |
PURPOSE:To make it possible to prevent damage from developing in chips by a method wherein a large number of chips formed on a wafer are separated from one another by pressing a convex spherical surface part against the rear surface of the wafer, which is placed on a flexible mat supported peripherally. CONSTITUTION:A wafer 3 is seated on a mat 2 under the state that the surface, onto which chips are formed, of the wafer 3 faces to the top surface of a tape 8. A pressing plate 6 is moved downwards so as to press a convex spherical surface part 7 against the rear surface of the wafer 3. The wafer 3 pressed by the convex spherical surface part 7 deforms spherically and convexly downwards, resulting in starting to break at the central part of the wafer, and breaks spread to the periphery of the wafer. On the other hand, no more force is applied to broken parts. Accordingly, even when the thickness of the wafer is thicker at its peripheral part than at its central part due to SiN film left at the peripheral part, pressures having same intensities are applied on respective chips formed on the wafer 3, resulting in developing no damage in the chips and allowing to precisely separate the chips at one time in both X and Y directions.
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