| 摘要 |
<p>PURPOSE:To prevent damage from developing in chips by a method wherein a tape, onto which a wafer is seated, is mounted under tension just under a flexible mat, which is supported peripherally, so as to press an upward projected spherical surface part against the rear surface of the wafer by pressing the mat, the tape and a pressing means against one another in order to separate chips from one another. CONSTITUTION:A wafer 3 is seated on a tape 8 under the state that the surface, onto which chips are formed, faces to a mat 2. Next, the mat 2 and the tape 8, which is located just under the mat 2, are moved downwards by a driving means in order to press them against a projected spherical surface part 7. Since the projected spherical surface part 7 is heated in advance up to a predetermined temperature, the ductility of the tape is enhanced. The wafer 3, which is pressed by the projected spherical surface part 7, deforms spherically and projects upward in the state where the wafer 3 is in contact with the rubber mat 2. As a result, the wafer starts to break at its central part and break spreads to its peripheral part. At that time, pressures having same intensities are applied on respective chips formed on the wafer 3, resulting in developing no damage in the chips and allowing to precisely separate the chips.</p> |
