发明名称 MANUFACTURE OF THICK FILM SUBSTRATE
摘要 PURPOSE:To reduce the manufacturing cost of a thick film substrate by providing a dividing line by a laser and positioning seals at the corners on a flat platelike ceramic substrate to print a desired pattern with the seals as a reference. CONSTITUTION:A sewing dividing line 5a of a square of 50mm of profile size and positioning seals 4 of circular recess of 0.5mm of diameter at three corners of a ceramic substrate 1 are formed with CO2 laser on the substrate 1, and the unnecessary parts 1a of the periphery of the substrate is divided and removed. Since it is formed after sintering, the influence of dimensional contraction due to sintering is not affected. Then, the seals 4 are so positioned in the ringlike pattern 6 of a screen mask as not to contact to form a mask, a conductor circuit 2 is printed and baked. A resistance circuit 3 is similarly formed. According to this configuration, the manufacturing cost of an accurate thick film substrate can be reduced.
申请公布号 JPS63273395(A) 申请公布日期 1988.11.10
申请号 JP19870108312 申请日期 1987.04.30
申请人 NEC CORP 发明人 TSUBOTA KAZUNARI
分类号 H05K1/16;H05K3/00;H05K3/12 主分类号 H05K1/16
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