| 摘要 |
<p>PURPOSE:To eliminate the deformations of a semiconductor device and a lead frame even if molding resin receives an external force by so increasing the width of a frame at the center of the frame that the side edge is disposed near the resin. CONSTITUTION:A pair of frame strips 12, 12 are connected by a plurality of frames 13, and so held as to dispose die pad leads 14 and stitch leads 15 between the frames 13. The frames 13 are so formed that the width at the lateral center of a lead frame 11 is larger than that of the other. Accordingly, a semiconductor device formed on the frame 11 is supported by the frames 13 from both sides by molding resin 20 to be scarcely deformed even by an external force.</p> |
