| 摘要 |
PURPOSE:To couple and bond a printed circuit substrate of metal-base substrate to other printed circuit substrate with high reliability by engaging a plurality of rises of the substrate with corresponding holes of the other substrate, effectively coupling them and then soldering both conductor patterns. CONSTITUTION:A printed circuit board 5 of a horizontal U-shaped section made of a metal-base material has cutout stoppers 12 at both ends of the risers 11, and its conductor pattern 2 is extended to the vicinity of the end face of the riser. A printed circuit board 5 made of a resin material has holes 13 corresponding to the risers 11 and a conductor pattern extended to the edge of the hole 13 corresponding to a conductor pattern 2. The riser 11 is inserted to the hole 13, and the pattern 2 is connected by soldering to the pattern 7. With this configuration, the substrate 1 is coupled and secured to the board 5 with mechanically and electrically sufficient strengths.
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