| 摘要 |
PURPOSE:To make it possible to use a standard molding die by spacing a deformed external lead apart from the resin-sealed body. CONSTITUTION:A molding die 26 is prepared which is suitable for the one in which external leads 3-11 are typically formed, a deformed external lead of the leads 3-11 needing no connection to a semiconductor chip 21 and a circuit substrate device 22 is caused to project to the boundary between a molding space 28 and the die 26 or to the neighborhood thereof, without being caused to effectively project into the space 28. The lead 9 is placed in a grooved channel 29 of the die 26 in which standard external leads are placed, and a liquid resin is injected into the space and set up, thereby obtaining a resin-sealed body 17 covering a supporting board 2, the chip 21, the device 22, connecting conductors 15 and connection parts 16 of the leads 3-11. Thereafter, the whole of the lead 9 is removed. Accordingly, the lead 9 is spaced apart from the sealed body 17 or is not effectively covered with the sealed body 17, so the removal of the whole lead 9 becomes easy after the resin molding.
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