Arrangement for the surface joining of thermally incompatible materials

摘要

Surface joining by soldering presuposes the use of thermally compatible materials. A solution for joining together even thermally incompatible materials by means of a surface soldered joint is therefore to be specified. For this purpose the invention provides that an intermediate carrier (1), made of a ductile material and coated on both sides with Cu-Ag (2, 3), be inserted between the two materials (7, 8) to be joined together, in which carrier a metallically conductive joint is provided between the top and bottom sides by way of throughplating and/or round plating (4, 9), The top and bottom sides of the intermediate carrier (l) are joined to the respective material by surface soldering (5, 6).