| 摘要 |
PURPOSE:To prevent a conductive adhesive material from short-circuiting and a circuit element from isolating by providing an insulating layer on an insulating substrate between a set of conductor layers. CONSTITUTION:A set of conductor layers 2a, 2b to which the electrodes 5a, 5b of a circuit element 4 are individually secured and wiring layers 3a, 3b connected thereto are formed by printing on an insulating substrate 1. Then, the layers 2a, 2b are covered with a lead protective glass layer 8. Thereafter, the substrate 1 between the layers 2a and 2b is coated with epoxy resin, the electrodes 5a, 5b of the element 4 are positioned, thermally cured, to form an insulating layer 6 and a conductive adhesive layer 7 to be completed. According to this configuration, the flow of the adhesive material is stopped to prevent it from short-circuiting. Since the substrate 1 and the element 4 are bonded through the layer 6, they are scarcely isolated.
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