| 摘要 |
PURPOSE:To avoid defects such as a short-circuit between inner leads or bonding wires and obtain a highly reliable semiconductor device by a method wherein some of the inner leads have smaller lead widths than the other inner leads and are extended closer to a die pad and have widened parts at their tips. CONSTITUTION:A die pad 2 on which a semiconductor element is mounted, a plurality of inner leads 4 whose tips are extended close to the die pad 2, outer leads extended outward from the inner leads 4 and tie-bars supporting the inner leads 4 and the outer leads are provided. In a lead frame like this, some 4b of the inner leads 4 have smaller lead widths t2 than the other inner leads 4a and are extended closer to the die pad 2 and have widened parts (f) at their tips. The inner leads 4b with the widened parts (f) at their tips and the inner leads 4a without the widened parts are, for instance, arranged alternately. |
