A radiation curable pressure sensitive adhesive composition comprising; (A) 100 parts by weight of a hydrogenated polybutadiene applied oligomer which has one or more ethylenically unsaturated terminal radicals in its molecule and in which 70 % or more of intramolecular carbon-carbon double bonds has been hydrogenated; (B) from 0.2 to 20 parts by weight of a chain transfer agent; and (C) from 0.001 to 1.0 parts by weight of a thermal polymerization inhibitor selected from metal complexes of N-nitrosophenylhydroxylamine; has an excellent storage stability and curing property and can provide pressure sensitive adhesive tapes which have excellent heat resistance and weatherability and are suitably used as surface protecting films.
