| 摘要 |
PURPOSE:To prevent a bonded surface from lifting by a method wherein an optical component, which is provided with a chamfer on the upper and the peripheral surface of the main body, and sealing resin applied onto the peripheral surface are provided, where the internal stress, which is induced when sealing resin shrinks, is guided to act obliquely downward toward a semiconductor chip. CONSTITUTION:An optical component 19 is bonded to the surface of a semiconductor chip 12 and a chamfer 22, which is provided on the area of the optical component 19, is extending from an upper surface 20, on which a light ray is incident, on an opposite side of the semiconductor chip 12 downward to a part or the whole of a peripheral surface 21. And, the semiconductor chip 12 and the optical component 19 are bonded along the peripheral face with a sealing resin 24, where the internal stress induced owing to shrinkage of the sealing resin 24 can be directed to act obliquely downward, that is, in the direction of an arrow B. By these processes, an action which presses the optical component 19 against the semiconductor 12 can be obtained, so that a bonded surface can be prevented from lifting.
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