| 摘要 |
PURPOSE:To contrive an increase in packaging density by a method wherein an electronic component is directly fixed by pressure on the side of a printed substrate to connect electrically with the side of the printed substrate through the side of bearing pieces. CONSTITUTION:Insertion holes 1a are opened in a printed substrate 1 and bearing pieces 2 for contriving the electrical connection of the side of such an electronic component 3 as a semiconductor chip with the side of the printed substrate 1 are inserted in the insertion holes 1a. The semiconductor chip 3 is fixed by pressure and fixed on the side of the substrate 1 with a bonding agent in such a way that the chip 3 is mounted on these bearing pieces 2 and lastly, the chip 3 and the pieces 2 are enveloped and sealed en masse from the upper side by means of an insulative resin, for example. That is, such the electronic component 3 as the semiconductor chip is directly fixed by pressure on the side of the bearing pieces 2 without performing a wire bonding to connect electrically with the side of the printed substrate. Thereby, an increase in packaging density becomes possible. |
