Reticular detector array

摘要

A detector assembly for reception of infrared radiation is formed as a composite structure of a detector array electrically connected by a set of contacts to a readout clip disposed on a backside of the assembly opposite a front side receiving incident radiation. Individual detectors are formed of layers of P-type and N-type semiconductor material, and are spaced apart from each other and from the readout chip by resilient electrically-insulating polymeric material which supports the detectors in their respective positions while allowing for thermally induced displacement of the detectors from their respective positions. A metallic grid on the front surface of the assembly provides a common electrical connection of the detectors to the readout chip. An antireflective coating may also be placed on the front surface of the assembly.