发明名称 HEAT INSULATING STRUCTURES FOR LOW-TEMPERATURE OR CRYOGENIC PIPINGS
摘要 <p>A heat insulating structure for low-temperature or cryogenic pipings, comprising at least one heat insulating barrier and at least one moisture barrier which are laid on the outer suface of a piping to be heat-insulated, and at least one sheathing layer, wherein said heat insulating barrier comprises an extruded styrenic resin foam and wherein, as expressed in terms of the three-dimensional coordinates X (circumferential direction), Y (thicknesswise direction) and Z (longitudinal direction), said heat insulating barrier has a Y-axial water vapor permeability Py of 1.5 g/m2?hr or less and at least the heat insulating barrier most adjacent to said piping has X-axial and Z-axial elongations at rupture Ex and Ez in the range of 8 to 40 percent.</p>
申请公布号 CA1244336(A) 申请公布日期 1988.11.08
申请号 CA19840456122 申请日期 1984.06.07
申请人 DOW CHEMICAL COMPANY (THE);ASAHI CHEMICAL INDUSTRY CO., LTD. 发明人 NAKAMURA, MASAO;TONOKAWA, HIROSHI
分类号 F16L9/14;F17C7/02;(IPC1-7):F17C7/02 主分类号 F16L9/14
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