| 摘要 |
PURPOSE:To prevent collision of a wafer with a turning frame of a blade and destruction of the wafer by making the wafer into a state where the same is integrated with a suction plate at the time when the wafer is cut off, by a method wherein the suction plate is sucked to an ingot by holding the suction plate stably by a holding device. CONSTITUTION:A suction plate 6 in a state where the same is connected with a stopper flange 16b is positioned by moving the same until an opening for suction comes into contact with the bottom of an ingot 1 by moving a rigid shaft 61a upward by a moving device. The suction plate 6 and ingot 1 are sucked and integrated by feeding negative pressure to the opening for the suction through a vacuum tube 66. The rigid shaft 61a is moved downward by inverting the moving device to a position where a predetermined gap is kept between the flange 61b and suction plate 6 and force holding the suction plate 6 substantially becomes a state where the force other than suction force due to air suction does not act upon. Cutting operation of a wafer is performed under this state. When the wafer is separated from the ingot, the suction plate 6 integrated with the wafer is dropped and connected with the stopper flange 61b by fitting to the same. |
