| 摘要 |
PURPOSE:To obtain a laminate excellent in flame retardance and flexibility and capable of simplifying a production process for a three-dimensional wiring circuit board, by laminate-molding prepregs each obtained by impregnating an sheetlike base with a composition based on a dimer acid-modified halogenated epoxy resin and drying it. CONSTITUTION:A dimer acid-modified halogenated epoxy resin (A) is obtained by performing an addition reaction of the COOH groups of a 36C dimer acid obtained by polymerizing, by the Diels-Alder reaction, a high linolic acid or linolenic acid content unsaturated fatty acid such as tall oil fatty acid with a bisphenol A halogenated epoxy resin. The predetermined number of prepregs each obtained by impregnating a sheetlike base (B) such as a glass cloth with a composition prepared by mixing component A as a base with dicyandiamide, 2-ethyl-4-methylimidazole or the like and drying it are laminated, and copper foils are optionally applied to both surfaces and molded under applied heat and pressure to obtain a laminate.
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