发明名称 Method and manufacture for electrically insulating base material used in plated-through printed circuit panels
摘要 Method and manufacture for electrically insulating base material used for perforated plated-through printed circiut panels with a metal core. The method includes applying a radiation-curable layer of insulating material to the preperforated metal core by an electrostatic spray method and precuring by irradiation or heat, coating with a further thin, thermally curable layer of insulating material by electrophoresis, drying the layer by heating and likewise partially curing it so that it is no longer capable of flowing, but yet is still reactive, optionally applying further curable insulating layers, and finally, fully thermally curing the entire coating of insulating material. The coatings obtained are impervious and are of uniform thickness even at the hole walls.
申请公布号 US4783247(A) 申请公布日期 1988.11.08
申请号 US19860863569 申请日期 1986.05.15
申请人 HOECHST AKTIENGESELLSCHAFT 发明人 SEIBEL, MARKUS
分类号 H05K3/18;H05K1/05;H05K3/44;(IPC1-7):B05D5/12;B05D1/36 主分类号 H05K3/18
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