发明名称 GOLD SULPHITE ELECTROPLATING SOLUTIONS
摘要 <p>An electroplating bath solution comprising an alkali metal or ammonium gold sulphite, a water soluble salt of thallium metal to effect brightening and grain refinning, and a non-hydroxy, non-amino carboxylic acid such as formic acid and oxalic acid to ensure that the bright gold metal deposit has a hardness lower than about 90 Knoop. The method of depositing the bright gold metal on various substrates from such electroplating solutions is also described and claimed.</p>
申请公布号 CA1244373(A) 申请公布日期 1988.11.08
申请号 CA19840444728 申请日期 1984.01.05
申请人 OMI INTERNATIONAL CORPORATION 发明人 BAKER, KENNETH D.;SCHEIDER, HANS
分类号 C25D3/48;C25D3/62;(IPC1-7):C25D3/48 主分类号 C25D3/48
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