发明名称 |
GOLD SULPHITE ELECTROPLATING SOLUTIONS |
摘要 |
<p>An electroplating bath solution comprising an alkali metal or ammonium gold sulphite, a water soluble salt of thallium metal to effect brightening and grain refinning, and a non-hydroxy, non-amino carboxylic acid such as formic acid and oxalic acid to ensure that the bright gold metal deposit has a hardness lower than about 90 Knoop. The method of depositing the bright gold metal on various substrates from such electroplating solutions is also described and claimed.</p> |
申请公布号 |
CA1244373(A) |
申请公布日期 |
1988.11.08 |
申请号 |
CA19840444728 |
申请日期 |
1984.01.05 |
申请人 |
OMI INTERNATIONAL CORPORATION |
发明人 |
BAKER, KENNETH D.;SCHEIDER, HANS |
分类号 |
C25D3/48;C25D3/62;(IPC1-7):C25D3/48 |
主分类号 |
C25D3/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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