| 摘要 |
PURPOSE:To enable development with an alkaline aq. soln. and to obtain a solder mask having superior resolution and heat resistance by using a specified photopolymerizable unsatd. compd., a photopolymerizable monomer and a sensitizer and/or a sensitizer system which produces free radicals under active rays of light. CONSTITUTION:This photosensitive resin compsn. contains a photopolymerizable unsatd. compd. by allowing hydroxyl groups in a hydroxystyrene polymer having repeating units represented by formula I to react with isocyanatoethyl methacrylate in 0.1-0.9 ratio of isocyanato equiv. to hydroxyl equiv., a photopolymerizable monomer and a sensitizer and/or a sensitizer system which produces free radicals under active rays of light. In formula I, D is a comonomer, m is a positive number and n is 0 or a positive number. When the resin compsn. is used, an image having a large thickness and high resolution can be formed with a dil. aq. alkali soln. as a developer and a solder mask having high reliability and superior heat resistance can be formed. |
