| 摘要 |
PURPOSE:To easily mount the title sensor to a narrow space, by connecting the metal layer covering the inner wall of the through-hole provided to an insulating substrate to the wiring on the substrate and fixing the spherical protruding electrode protruding on the outer surface side of the substrate by the solder filling the through-hole to be closely adhered to the metal layer. CONSTITUTION:The peripheral corners of the upper and lower surfaces of the through- hole 6 provided to an insulating substrate 4 are removed in order to avoid the cutting of the metal layer 73 guided from the inner surface of the substrate 4 to the back surface thereof. A spherical body 8 having a diameter larger than the inner diameter of the through-hole 6 is fixed to the through-hole 6 by soldering. The material quality of the spherical body 8 has conductivity and is solderable and, for example, a copper sphere to which nickel plating is applied is used as the spherical body 8. A lid 2 is bonded to the metal layer 72 of the substrate 4 by solder 9 but Au-Sn type solder 9 is used in order to keep corrosion resistance. The connection of a pressure sensor to an external circuit is performed, for example, by soldering the protruding electrodes composed of the spherical bodies 8, 81 protruding from the under surface of the substrate 4 to the wiring conductor on a printed wiring board. Therefore, the height from the upper surface of the wiring board is low and this sensor occupies no large space.
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