| 摘要 |
PURPOSE:To realize a wide range of application from a device for very small electric current use to the device for big electric current use and to improve an adhesive force at a connection part by a method wherein both terminals are made to be electrically conductive by a soldering operation and, at the same time, a thermosetting resin is hardened at least halfway. CONSTITUTION:Preliminary solders 25 and 26 are applied to each extracttion terminal 22 on a substrate 21 and to each connection terminal 24 on an FPC 23. A thermosetting resin 30 is coated on the whole face where the terminals are formed. This thermosetting resin 30 is used to bond the substrate 21 to the FPC 23. During this process, the thermosetting resin 30 is coated on one face of the substrate 21 or the FPC 23 or on both faces. As the thermosetting resin 30 a resin which starts hardening at about 50-100 deg.C is desirable and, e.g., an epoxy resin, a polyester resin or the like can be used. Then, the extraction terminal 22 on the substrate 21 and the connection terminal 24 on the FPC 23 are positioned and mated. Both terminal parts are mated while a pressurization force P is exerted from the upper part and the lower part; they are heated at a temperature at which a solder is melted, and are pressed. Because the substrate and the printed-circuit board are bonded by using the thermosetting resin and the solder, the adhesive strength is enhanced.
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