| 摘要 |
PURPOSE:To lower the resistance of a conductor, improve the ununiformity of printed density, reduce etching time and obtain a high pattern accuracy, by composing an electrode conductor layer of an undercoat metallic layer provided on a heat generating resistor layer for Cu plating and a plated Cu layer provided on the undercoat metallic layer. CONSTITUTION:A common electrode body, a ground terminal and an external connection terminal part are provided by sequentially providing a plate Cu layer 41, a plated Cu layer 42 and a plated Ni layer 5 on an insulating thin film layer (Ta2O5 layer) 2 and a heat generating resistor layer 3 which are provided on a glazed alumina ceramic substrate 1. A heat generating resistor layer 6 is protected by an abrasion-resistant layer 7, and the parts exclusive of a bonding part for mounting a driving IC and an external connection terminal are protected by an insulating resin. The plated Cu layer 42 has a thickness of about 20mum, so that a difference in voltage drop based on a difference in circuit resistance is small even when a large current is passed at the time of operating a thermal head, and a uniform printed density can be ensured. |
