| 摘要 |
PURPOSE:To shield an external electrical noise and to easily shade the external light by a method wherein a semiconductor chip is covered with a light- transmitting resin and its outside is surrounded by a light-shading conductive resin. CONSTITUTION:A semiconductor chip 11 is mounted on a grounding lead 12a formed by a lead frame. Then, a light-transmitting resin 14 is coated at least on the upper part of a light-receiving part of the semiconductor chip 11; leads 12a-14a are connected collectively. A light-shading conductive resin 15 which surrounds the external circumference of the light-transmitting resin 14 excluding the upper part of the light-receiving part of the semiconductor chip, the power- supply lead 12b and the output lead 12c and which is connected to the grounding lead 12 is formed. As this light-shading conductive resin 15, e.g., an epoxy resin to which C is added is suitable because it can shade the light and can display a desired electrical shielding effect due to its electric conductive performance. |
